By Our Correspondent
BHUBANESWAR: Siksha ‘O’ Anusandhan Deemed to be University (SOA) has signed a Memorandum of Understanding with Very Large Scale Integration Society of India (VSI), Bengaluru, for working together towards developing innovation, research, start-ups, talent and employment opportunities in areas of VLSI Design and Semiconductors.
VSI has more than 5000 semiconductor professionals and volunteers across the world representing full semiconductor supply chain. The MoU will enable SOA to build the required innovation, research and talent pipeline for the current and future needs of the India semiconductor industry.
The MoU was signed by SOA Vice-Chancellor Prof. Pradipta Kumar Nanda and VSI President Dr. Satya Gupta on Saturday.
As per the agreement, VSI will collaborate with SOA in harnessing research and innovation talent for building and enhancing a strong start-up ecosystem and provide industry collaboration in terms of techno-commercial mentorship, market opportunities, industry connects, angel and seed funding at SOA.
Besides, VSI and SOA will collaborate in promoting and helping research activities in VLSI Design and Semiconductor domains for current and future technology needs and trends.
VSI and SOA will jointly organize workshops and training programs for students and faculty members of the Deemed to be University and other nearby institutions. VSI will also support through its industry volunteer network in arranging expert lectures, projects, internship opportunities and mentoring of SOA students at undergraduate, post-graduate and doctorate level.
The two organisations will also work together in developing and enhancing the VLSI Design and Semiconductors curriculum at undergraduate, post-graduate and doctorate level and make these programs relevant for current and future industry needs for SOA and other institutions. VSI will provide help in implementing these courses.
VSI and SOA will also work together to promote awareness regarding Electronics and Semiconductors and the career opportunities among high school students and parents to attract students to this field while choosing their engineering branches.
